US and EU Patents (OPROCESSOR INC) > Reference

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1. Optical module and optical communication network system having the same

US Patent No.: US11,249,261,B2, Date of Patent: Feb. 15. 2022.

EU Patent No.: EP 4,024,103,A1, Date of patent: Jun. 7. 2022.

Applicant: OPROCESSOR INC

This patent claims the intellectual property for the method to input an optical signal into the optical waveguide using a prism and micro-lens  where the base of micro-lens should be located closer to the light source. We believe this claim is very powerful, because anyone who wants to make an optical link on a silicon chip using dielectric materials like Si₃N₄, SiO_xN_y, SiO₂ must use a prism and a micro-lens in the same way as this patent.

This patent also invents a new method to realize wavelength division multiplexing (WDM) using prisms where thin film filters are deposited on the plane of the prism.   

As soon as the optical network chip (ONC) is commercialized, this patent is essential to protect the intellectual property from any infringement on the patent’s claims. This patent is registered in the US and the EU, and will be registered soon in Korea.

2. Optical module package

US Patent No.: US 11,300,740 B1, Date of Patent: Apr 12. 2022.

Applicant: OPROCESSOR INC

The patent claims the intellectual property for the potential optical links which might be realized on the interposer chip of a 2.5D GPU package graphic card as currently sold on the computer market. The potential optical links consist of the structure of the optical and electrical layers in the interposer chip and the methods of attaching optical modules to the same chip. 

The representative figure describes the idea of the invention. The interposer chip is designated by part number 110. Part numbers, 402 and 403 represent a CPU and a GPU. The optical waveguide, an optical module, and a prism are represented by the numbers, 124, 201, and 250, respectively. All the parts and layers except for optics parts represent the structure of the interposer chip of the 2.5D GPU package as currently contained in a commercial graphic card.

3. Optical module and method for manufacturing the same

US application No.: US16/739,736, Date of application: Jan. 10. 2020.

Applicant: OPROCESSOR INC

This invention claims the intellectual property for the method of using a thermo-set polyimide as an adhesive to attach an optical prism to the optical waveguide. If anyone tries to use thermo-set polyimide as an adhesive to attach one body to another in the way outlined in this invention, it would be considered an infringement of our rights.

There are many places where thermo-plastic polyimides have been used as  adhesives and because of its prior use, it cannot be deemed a patent. Because the thermo-plastic polyimide becomes more flexible (i.e. changes its shape) typically above 200°C, it does not retain its adhesive strength to the point that it cannot be used at 400°C. On the other hand, the thermo-set polyimide becomes harder as the temperature increases so that it can be used as an adhesive at 400°C or higher. Until this point, there has never been an instance in which the thermo-set polyimide has been used as an adhesive. We were the first to discover its ability to serve as an adhesive.